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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Effects of Temperature, Moisture, Mechanical and Electrical Driving Forces
by E-H Wong and others
RRP $284.95
$255.35
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Hardback
Pub: 01/06/2015
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.
The text presents a thorough review of this important field of research, providing users with a… more
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.
The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.
The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.
less- ISBN:
- 9781845695286
- 9781845695286
- Category:
- Technology: general issues
- Format:
- Hardback
- Publication Date:
- 01-06-2015
- Language:
- English
- Publisher:
- Elsevier Science & Technology
- Country of origin:
- United Kingdom
- Dimensions:
- 228.6x152.4mm
This title is in stock with our Australian supplier and should arrive at our Sydney warehouse within 1 - 2 weeks of you placing an order.
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