This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
- ISBN:
- 9783319854618
- 9783319854618
-
Category:
- Circuits & components
- Format:
- Paperback
- Publication Date:
-
09-05-2018
- Publisher:
- Springer International Publishing AG
- Country of origin:
- Switzerland
- Pages:
- 182
- Dimensions (mm):
- 235x155mm
- Weight:
- 3.05kg
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