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Thermal Management of Led Packages and Applications

Thermal Management of Led Packages and Applications

by Luo and Xiaobing Luo
Hardback
Publication Date: 12/08/2024

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Written by a leading expert in LED packaging technologies, this book systematically introduces fundamental theory and practical design approaches to IC/LED product design. Readers get a good grounding in thermal management strategies with topics such as heat transfer fundamentals, thermal modeling, and thermal simulation and design. Additionally, cooling technologies and testing techniques are provided to help readers evaluate device performance and to shorten the design and manufacturing cycle.
ISBN:
9781119179276
9781119179276
Category:
Electronics & communications engineering
Format:
Hardback
Publication Date:
12-08-2024
Publisher:
John Wiley & Sons (Asia)
Pages:
300

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