This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
- ISBN:
- 9780387765327
- 9780387765327
-
Category:
- Electrical engineering
- Format:
- Hardback
- Publication Date:
-
19-09-2008
- Language:
- English
- Publisher:
- Springer-Verlag New York Inc.
- Country of origin:
- United States
- Pages:
- 410
- Dimensions (mm):
- 235x155x22mm
- Weight:
- 0.73kg
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